Compact models are used by circuit designers using SPICE modeling tools to design analog or digital circuits for high-frequency and/or high-power circuits for many different applications. The process of translating the device’s performance into an accurate model is an interesting and complex process. If you are interested in learning more about the ASM-HEMT model for GaN HEMTs from its developer, please consider joining us for this insightful presentation. Abstract: Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs) and their associated RF and power-electronic applications have been a topic of aggressive academic and industrial research over the past couple of decades. This is due to the commendable level of performance promised by the GaN material system and the hetero-junction that it forms with AlGaN, leading to features such as high breakdown voltage, high mobility, high saturation velocity, high sheet carrier density, the ability to withstand high operating temperatures etc. In order to take full advantage of these properties and to translate them into viable circuit applications a fully robust and accurate GaN HEMT model is of prime importance. In this talk, I will present our ASM-HEMT model for GaN-based power and RF devices. I will also briefly talk about our efforts in modeling of SiC based MOS transistors. Speaker(s): Yogesh Singh Chauhan, Agenda: 8:30 to 9:00 am Eastern Time, sign in 9:00 to 10:00 am Eastern Time, Seminar 10:00 am to 10:30 am Eastern Time, Questions and discussions. Virtual: https://events.vtools.ieee.org/m/420980

The IEEE Vehicular Technology Society (VTS) Philadelphia Chapter is holding a technical meeting. The topic is NFPA 130 Wire and Cable Requirements. Our speaker is Alex Marciano, Application Engineer, Marmon Industrial Energy & Infrastructure Group. This presentation discusses the requirements given by NFPA 130 for wire and cable. The lecture will discuss non-emergency and emergency circuit requirements. Mr. Marciano will explain how cables are protected by following materials, installation, and testing requirements given by NFPA 130, NFPA 70, IEEE 1202, and UL 2196. A slide show summarizes the codes and standards, as well as showing photographs of cable testing and installation methods to meet requirements. Attendees may apply for 1.0 PDH provided through the IEEE Certificates Program, accepted in all states. Send $5.00 (USD) payment to Brandon Swartley via Zelle at [email protected] and complete the online evaluation at https://r2.ieee.org/philadelphia-vts/forms/. Evaluation form must be completed and payment received within one week to receive PDH certificate. Speaker(s): Alex Marciano Agenda: Introduction Technical presentation - Non-Emergency Circuits • Chapter 12 wiring requirement - non-emergency • FT4/IEEE1202 vertical flame and smoke release test • UL 1685 vertical flame and smoke release test - Emergency Circuits • NFPA 130 wire requirements, design, reliability, emergency circuits, fire alarm and communication cables NFPA 70 areas of assembly • UL 2196 fire resistive certification and FHIT listings and selection • What is a complete system? Known issues Questions Virtual: https://events.vtools.ieee.org/m/419802

Emotional Intelligence is one of the human power skills that is more in demand today than ever. Leaders that excel at EQ are going to be the ones most sought after and indispensable in organizations. In this talk we will - Build a clear understanding of the Emotional Intelligence Model - Help you to understand your responses and how your mindset and emotions have an impact Speaker(s): Nikki Evans Agenda: IEEE-USA's free webinars/events are designed to help you find your next job, maintain your career, negotiate an appropriate salary, understand ethical considerations in the workplace and learn about other career-building strategies and public policy developments that affect your profession. For information regarding upcoming webinars or to visit our vast webinar archive, please visit: (https://ieeeusa.org/careers/webinars/) (https://newsletter.smartbrief.com/rest/sign-up/2479DAB0-4089-43E7-925D-86AE0C1E6244?campaign=e0d52cef) Virtual: https://events.vtools.ieee.org/m/409083

IEEE DeVry University Student Branch and CompTIA Student Club Present "Managing users accounts in Linux” By: Dr. Simon Obeid Date/Time: Thursday, June 6th @ 5:00 pm CST/6:00 pm EST In this workshop, we will discuss user management in Linux. We learn how to create a user account, add it to a group and delete users accounts. Also disabling users accounts and changing passwords will be demonstrated. To Join: https://devry.engageli.com/devry/current/cr8-h7v-4op/? Dr. Simon Obeid earned his Ph.D. in electrical engineering from the University of North Carolina in 2008, where he also earned his Master of Science degree in electrical and computer engineering and Graduate Certificate in Information Security. A member since 2003, Obeid served as the chair of the IEEE (Institute of Electrical and Electronics Engineers) Computer Society for the DeVry Charlotte chapter from 2009-2012, and as vice chair the year before. He is ABET evaluator since 2015. For Widely published, Obeid has presented his research at dozens of conferences and has served as a reviewer or guest speaker for many others. He was invited to speak to Tech Tactics conference 2023 about Security Awareness for K-12 education. Virtual: https://events.vtools.ieee.org/m/422927

June ExCom Meeting Agenda: TBD Bldg: MAI, (Checkpoint Surgical) 6050 Oak Tree Blvd, Independence, Ohio, United States, Virtual: https://events.vtools.ieee.org/m/420477

Abstract: Thermoelectric power generators can convert waste heat into useful electrical energy, but traditional thermoelectric device manufacturing uses bulk material processing with machining, assembly, and integration steps which lead to material waste and performance limitations. The traditional manufacturing approach offers virtually no flexibility in designing the architecture of thermoelectric modules, especially at multiple length scales. Additive manufacturing can overcome these challenges. Although printing techniques, including 3D printing, have been explored for thermoelectric devices, these techniques have been limited to organic or organic-inorganic composite materials. Additive manufacturing solutions have not been demonstrated for inorganic thermoelectric materials. This presentation will describe our progress in laser-based additive manufacturing of thermoelectric materials such as tellurides and silicides. Laser powder bed fusion (also known as selective laser melting) is an additive manufacturing process which locally melts successive layers of material powder to construct three-dimensional objects. When applied to thermoelectric materials, this technique could enable new shapes, hierarchical structuring, material-to-device integration, and large-area processing. The presentation will show the first demonstrations of laser additive manufacturing applied to thermoelectric materials and discuss the link between materials, manufacturing, and system-level considerations for thermoelectric power generators. Speaker(s): Prof. Saniya Agenda: - Date: 6 June 2024 - Time: 06:00 PM to 07:00 PM Virtual: https://events.vtools.ieee.org/m/421017

Training Deep Neural Networks (DNNs) requires a large number of operations, among which matrix-vector multiplies (MVMs), often of high dimensionality, dominate. In-Memory Computing (IMC) is a promising approach to enhance MVM compute efficiency and throughput, but introduces fundamental tradeoffs with dynamic range of the computed outputs. While IMC has been successful in DNN inference systems, it has not yet shown feasibility for training, which is more sensitive to dynamic range. This work leverages recent work on alternative radix-4 number formats in DNN training on digital architectures, together with recent work on high-precision analog IMC with multi-level inputs, to enable IMC training. Furthermore, we implement a mapping of radix-4 operands to multi-level analog-input IMC in a manner that improves robustness to analog noise effects. The proposed approach is shown in simulations calibrated to silicon-measured IMC noise to be capable of training DNNs on the CIFAR-10 dataset to within 10% of the testing accuracy of standard DNN training approaches, while analysis shows that further reduction of IMC noise to feasible levels results in accuracy within 2% of standard DNN training approaches. Co-sponsored by: Wright-Patt Multi-Intelligence Development Consortium (WPMDC), The DOD & DOE Communities Speaker(s): Christopher Grimm Agenda: Training Deep Neural Networks (DNNs) requires a large number of operations, among which matrix-vector multiplies (MVMs), often of high dimensionality, dominate. In-Memory Computing (IMC) is a promising approach to enhance MVM compute efficiency and throughput, but introduces fundamental tradeoffs with dynamic range of the computed outputs. While IMC has been successful in DNN inference systems, it has not yet shown feasibility for training, which is more sensitive to dynamic range. This work leverages recent work on alternative radix-4 number formats in DNN training on digital architectures, together with recent work on high-precision analog IMC with multi-level inputs, to enable IMC training. Furthermore, we implement a mapping of radix-4 operands to multi-level analog-input IMC in a manner that improves robustness to analog noise effects. The proposed approach is shown in simulations calibrated to silicon-measured IMC noise to be capable of training DNNs on the CIFAR-10 dataset to within 10% of the testing accuracy of standard DNN training approaches, while analysis shows that further reduction of IMC noise to feasible levels results in accuracy within 2% of standard DNN training approaches. Virtual: https://events.vtools.ieee.org/m/422920

We welcome spouses and partners to a day of activities on Saturday during the joint meetings: Agenda: IEEE Region 1 & 2 Companion Program (Updated 5/7/2024) Saturday June 8, 2024 Price per person: $75 8:30 AM: Depart from Hotel Lobby 9:00 AM to 11:00 AM: Stamford Museum & Natural Center ((https://www.stamfordmuseum.org/)) 11:30 AM to 12:30 PM: Lunch Sign of the Whale ((https://www.signofthewhalect.com/)) 1:00 PM to 2:30 PM: Pedal Cruise (https://pedalcruise.com/stamford-ct); 3:30 PM: Return to Hotel Stamford Marriott Hotel & Spa , 243 Tresser Blvd, Stamford, Connecticut, United States, 06901

Please join us for the monthly administrative meeting of the IEEE Washington Section. All IEEE members in our Section are welcome to attend. IEEE members who wish to volunteer for the Washington Section Administrative Committee are encouraged to attend. Co-sponsored by: Sastry Kompella Agenda: Agenda will be provided soon. Room: Multi-Purpose Room B, Bldg: College park Airport Operations Building, 1909 Corporal Frank Scott Dr , College Park, Maryland, United States, 20740, Virtual: https://events.vtools.ieee.org/m/422291