Metallization of glass core and through-glass vias

As glass is gaining a lot of attention and momentum as a state of the art semiconductor packaging technology, industry is looking to complete the supply chain to enable this promising technology. Several advances have been made in the field of metallizing glass core through vias, and in today’s presentation, we will discuss several options and MKS’ take on delivering a manufacturable solution. We will discuss options for seed layer deposition and highlight the MKS wet metallization technique that allows us to directly plate on glass. We will also go over several options for electrolytic plating of the bulk copper conductor for the through glass vias. Co-sponsored by: Habib Hichiri Speaker(s): Jobert van Eisden, Virtual: https://events.vtools.ieee.org/m/412596