October 1, Tuesday, 6~ 8:00 PM Virtual Seminar through IEEE WebEx hosting For program questions, Please email to [email protected] Co-sponsored by: New York Section and Region 1 & Region 2 Computer Society Speaker(s): Mrinal , Agenda: - Event Agenda - Event Agenda: 6:00 PM Opening Remark – IEEE NY Section Chair, Chamara Johnson Welcome - Introduction - (Prof. Ping-Tsai Chung, IEEE New York Section, Vice Chair of Section Activities & Prof. Xin-Zhou Wei, IEEE New York Section, Chair of Student Activities) 6:10 ~7:10 PM (Presentation- Mrinal Karvir, Manager, Intel - Generative AI) 7:10 PM Q/A Virtual: https://events.vtools.ieee.org/m/430850

This talk highlights the next generation of wireless power transfer (WPT) network concept that is scalable, safe, and efficient and can be deployed in a UAS by incorporating waveform engineering, electromechanical beamforming, integrated phased-array antenna, and transmitter (TX)/receiver (RX) co-design. Although interest in radiative (far-field) WPT using beamforming has been growing rapidly because of its capability to energize a large number of autonomous devices, most of these works are still in the theoretical phase without any practical implementation. This talk presents the implementation of a distributed beamforming network using a bottom-up approach (from the antenna to the inter-connected network) that is highly important for addressing the challenges associated with a dynamically changing environment. Practical system-level implementation strategies and multi-scale and multi-technique approaches to building a resilient WPT network for UAVs will be discussed. First, the challenges associated with the dual approach of electrical beamforming and the mechanical steering of the TX antennas to maximize the RF-RF link efficiency will be discussed. Secondly, an investigation of the efficient rectifier circuitry designed on-chip as well as commercial off-the-shelf components (COTS) to maximize the power conversion efficiency RF-DC efficiency will be presented. Finally, future research directions on increasing the power transfer distance to scale up the amount of power delivered to the load for the proposed wireless power beaming network system will be highlighted. Co-sponsored by: Ali Daneshmand Speaker(s): Ifana, Agenda: Virtual: https://events.vtools.ieee.org/m/428457

[] On this celebratory IEEE Day, let us rejoice in the combined IEEE worldwide activities of 39 technical societies and 7 interdisciplinary councils on one side of the IEEE coin, balanced with local sections and student chapters, bringing a physical presence of IEEE to local communities. By the way, one could argue that IEEE also has a 3rd leg into humanitarian activities. These S/C span a great swathe from hardware to software, including electronic devices, solar/wind energy production, power transmission, control theory, image compression, signal processing, and computer architecture. One could say this moves from applied physics to applied math. However, this session drills down to predominantly 1 of these societies, the electron device society, where the field of semiconductor materials and devices thrives. So, with the USA's Chips and Science Act to onshore semiconductor chip manufacturing, what does this mean to you and your communities. First, the Chips portion supports semiconductor companies to build or expand domestic chip production. The Science portion aims to perform workforce development to populate those factories. Where will this new workforce come from and what do you need to do to prepare for your future? This talk aims to take a critical look at the opportunities before you in the semiconductor industry. With time permitting and audience interest, some discussion in humanitarian roles IEEE plays will also be discussed. Speaker(s): Paul Berger, PhD Virtual: https://events.vtools.ieee.org/m/434305

Please join us for IEEE WIE Philadelphia Section for a professional development on Mindset Matters Speaker(s): Lyla Cookson, Virtual: https://events.vtools.ieee.org/m/434087