Beyond Moore: 3D Memory, 3D Packaging

“If we make them smaller, we can make them faster” has been the approach to building faster computers over the last 70-years starting with the first transistors and continuing as we built increasingly more complex integrated circuits. This was known as “Moore’s Law”. Recently, our technology is no longer achieving higher densities as we scale to smaller features sizes first with NAND Flash and now with SRAM and DRAM. New techniques known as Beyond Moore are required to continue to build faster and more complex computers. David Bondurant reviews the emergence of 3D memory and 3D packaging as today’s approach to building the fastest Supercomputers and AI Processors. Virtual: https://events.vtools.ieee.org/m/455111