Week of Events
IEEE Talk on Computational Nanophotonics
IEEE Talk on Computational Nanophotonics
We will be having a talk presented by Prof Salah Obayya, IEEE Fellow. This is a pre-recorded talk for those who were unable to make the original talk. The talk will be over the Teams link provided below. Virtual: https://events.vtools.ieee.org/m/446835
IEEE Dayton Section Quarterly Meeting
IEEE Dayton Section Quarterly Meeting
IEEE Dayton Section will host the quarterly membership meeting with lunch and a Senior Membership drive afterwards. The event will include a free buffet lunch for IEEE Dayton Section members of all grades and requires registration by 5:00 pm, Nov. 20, 2024. Registration will be open starting Nov. 13th (if not sooner). Lunch networking Meeting Agenda: - IEEE Dayton Section business - Planned events for 2024 Holiday party and activities for 2025 - Adjourn General Membership Meeting IEEE Senior Membership drive will occur afterwards The meeting will be held at University of Dayton Research Institute (UDRI) - Curran Place, 1700 S. Patterson Boulevard, Dayton, OH 45409 (https://udayton.edu/udri/about/locations/curran_place.php) NOTE: Detailed information about UDRI facility access and parking information will be provided no later than 1 day prior to the event, following registration deadline For more information contact Dr. Amy Doll at [email protected]. Agenda: Lunch networking Meeting Agenda: - IEEE Dayton Section business - Planned events for 2024 Holiday party and activities for 2025 - Adjourn General Membership Meeting The IEEE Senior Membership drive will occur afterwards University of Dayton Research Institute (UDRI) - Curran Place, 1700 S. Patterson Boulevard, , OH , Dayton, Ohio, United States, 45409
IEEE Dayton Section Quarterly Meeting
IEEE Dayton Section Quarterly Meeting
IEEE Dayton Section will host the quarterly membership meeting with lunch and a Senior Membership drive afterwards. The event will include a free buffet lunch for IEEE Dayton Section members of all grades and requires registration by 5:00 pm, Nov. 20, 2024. Registration will be open starting Nov. 13th (if not sooner). Lunch networking Meeting Agenda: – IEEE Dayton Section business – Planned events for 2024 Holiday party and activities for 2025 – Adjourn General Membership Meeting IEEE Senior Membership drive will occur afterwards The meeting will be held at University of Dayton Research Institute (UDRI) – Curran Place, 1700 S. Patterson Boulevard, Dayton, OH 45409 (https://udayton.edu/udri/about/locations/curran_place.php) NOTE: Detailed information about UDRI facility access and parking information will be provided no later than 1 day prior to the event, following registration deadline For more information contact Dr. Amy Doll at aneidharddoll1@ieee.org. Agenda: Lunch networking Meeting Agenda: – IEEE Dayton Section business – Planned events for 2024 Holiday party and activities for 2025 – Adjourn General Membership Meeting The IEEE Senior Membership drive will occur afterwards University of Dayton Research Institute (UDRI) – Curran Place, 1700 S. Patterson Boulevard, , OH , Dayton, Ohio, United States, 45409
Thinfilm Varactors for Reconfigurable Microwave Circuits
Thinfilm Varactors for Reconfigurable Microwave Circuits
Thin film Barium Strontium Titanate (BaxSr1-xTiO3-henceforth BST) variable capacitor (varactor) tuning elements are key components for reconfigurable microwave circuits. This talk will introduce the thin film varactors and their demonstrated applications. The size, weight, and power (SWaP) savings using the chip scale tunable RF front end components is a game-changer for defense applications and key for the 5G/6G cellular communications. Co-sponsored by: Wright-Patt Multi-Intelligence Development Consortium (WPMDC), The DOD & DOE Communities Speaker(s): Guru Agenda: Thin film Barium Strontium Titanate (BaxSr1-xTiO3-henceforth BST) variable capacitor (varactor) tuning elements are key components for reconfigurable microwave circuits. This talk will introduce the thin film varactors and their demonstrated applications. The size, weight, and power (SWaP) savings using the chip scale tunable RF front end components is a game-changer for defense applications and key for the 5G/6G cellular communications. Virtual: https://events.vtools.ieee.org/m/446833